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| Type | Description |
|---|---|
| Series: | 116 |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 28 (2 x 14) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Elevated, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin-Lead |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass Alloy |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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523-13-084-11-045001Mill-Max |
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22-1518-11Aries Electronics, Inc. |
CONN IC DIP SOCKET 22POS GOLD |
In Stock: 0 $2.99189 |
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522-93-161-15-005003Mill-Max |
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In Stock: 0 $48.16040 |
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In Stock: 0 $23.02500 |
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558-10-272M20-001104Preci-Dip |
BGA SURFACE MOUNT 1.27MM |
In Stock: 0 $28.12896 |
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In Stock: 0 $23.21560 |
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523-93-125-13-041001Mill-Max |
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In Stock: 0 $50.58620 |
