Type | Description |
---|---|
Series: | 518 |
Package: | Bulk |
Part Status: | Active |
Type: | SIP |
Number of Positions or Pins (Grid): | 31 (1 x 31) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Brass |
Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature: | - |
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511-91-121-13-061002Mill-Max |
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18-3518-11Aries Electronics, Inc. |
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68-PLS11033-12Aries Electronics, Inc. |
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16-8430-10Aries Electronics, Inc. |
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In Stock: 0 $4.00400 |
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110-13-428-61-001000Mill-Max |
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510-83-081-09-000101Preci-Dip |
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36-6573-10Aries Electronics, Inc. |
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614-93-210-31-012000Mill-Max |
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614-13-241-18-075007Mill-Max |
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