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| Type | Description |
|---|---|
| Series: | PGM |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA |
| Number of Positions or Pins (Grid): | - |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | - |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | -55°C ~ 105°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
|
116-41-652-41-001000Mill-Max |
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In Stock: 0 $17.19893 |
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18-3508-30Aries Electronics, Inc. |
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122-13-210-41-001000Mill-Max |
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117-93-664-61-005000Mill-Max |
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522-93-238-19-086001Mill-Max |
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114-91-652-41-117000Mill-Max |
CONN IC SKT DBL |
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612-43-308-41-003000Mill-Max |
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614-83-422-41-001101Preci-Dip |
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In Stock: 0 $1.23670 |
