Type | Description |
---|---|
Series: | 546 |
Package: | Bulk |
Part Status: | Active |
Type: | PGA |
Number of Positions or Pins (Grid): | 391 (18 x 18) |
Pitch - Mating: | 0.050" (1.27mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | Flash |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Press-Fit |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Bronze |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
Image | Part Number | Description | Stock / Unit Price |
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20-8400-310CAries Electronics, Inc. |
CONN IC DIP SOCKET 20POS GOLD |
In Stock: 0 $10.80000 |
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1109800-24Aries Electronics, Inc. |
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