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| Type | Description |
|---|---|
| Series: | 57 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 32 (2 x 16) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Tin |
| Contact Finish Thickness - Mating: | 200.0µin (5.08µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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116-91-650-41-007000Mill-Max |
CONN IC SKT DBL |
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32-6823-90TAries Electronics, Inc. |
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522-13-225-15-000003Mill-Max |
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614-41-624-31-018000Mill-Max |
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114-43-632-41-117000Mill-Max |
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123-47-952-41-001000Mill-Max |
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17-71140-10Aries Electronics, Inc. |
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In Stock: 0 $10.24000 |
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144-PGM12001-51Aries Electronics, Inc. |
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