Type | Description |
---|---|
Series: | 116 |
Package: | Tube |
Part Status: | Active |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Number of Positions or Pins (Grid): | 8 (2 x 4) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Elevated, Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin-Lead |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Brass Alloy |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Operating Temperature: | -55°C ~ 125°C |
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111-93-636-41-001000Mill-Max |
CONN IC DIP SOCKET 36POS GOLD |
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114-47-316-41-117000Mill-Max |
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In Stock: 0 $12.52440 |
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32-1508-30Aries Electronics, Inc. |
CONN IC DIP SOCKET 32POS GOLD |
In Stock: 0 $10.52000 |
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126-93-636-41-001000Mill-Max |
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In Stock: 0 $16.35600 |
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04-7700-10Aries Electronics, Inc. |
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