Type | Description |
---|---|
Series: | 518 |
Package: | Bulk |
Part Status: | Active |
Type: | SIP |
Number of Positions or Pins (Grid): | 20 (1 x 20) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Gold |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Material - Post: | Brass |
Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature: | - |
Image | Part Number | Description | Stock / Unit Price |
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16-8380-310CAries Electronics, Inc. |
CONN IC DIP SOCKET 16POS GOLD |
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511-93-256-19-081003Mill-Max |
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322-93-120-41-001000Mill-Max |
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