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| Type | Description |
|---|---|
| Series: | 514 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA |
| Number of Positions or Pins (Grid): | 281 (19 x 19) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Surface Mount |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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511-93-069-11-061001Mill-Max |
SKT PGA SOLDRTL |
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614-93-069-11-061001Mill-Max |
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18-3518-01Aries Electronics, Inc. |
CONN IC DIP SOCKET 18POS GOLD |
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115-43-320-61-001000Mill-Max |
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20-6820-90CAries Electronics, Inc. |
CONN IC DIP SOCKET 20POS GOLD |
In Stock: 0 $10.78000 |
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210-1-32-006CnC Tech |
CONN IC DIP SOCKET 32POS GOLD |
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510-13-209-17-081001Mill-Max |
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In Stock: 0 $42.17480 |
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117-41-430-41-005000Mill-Max |
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18-1518-11Aries Electronics, Inc. |
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In Stock: 0 $2.46400 |
