Type | Description |
---|---|
Series: | 115 |
Package: | Bulk |
Part Status: | Active |
Type: | DIP, 0.9" (22.86mm) Row Spacing |
Number of Positions or Pins (Grid): | 52 (2 x 26) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | Flash |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Brass |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Operating Temperature: | -55°C ~ 125°C |
Image | Part Number | Description | Stock / Unit Price |
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515-13-132-14-071002Mill-Max |
SKT PGA SOLDRTL |
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121-13-304-41-001000Mill-Max |
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612-43-422-41-004000Mill-Max |
SKT CARRIER SOLDRTL |
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CONN IC DIP SOCKET 36POS GOLD |
In Stock: 0 $15.08545 |
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510-93-196-14-000003Mill-Max |
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06-2503-20Aries Electronics, Inc. |
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