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| Type | Description |
|---|---|
| Series: | 518 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.2" (5.08mm) Row Spacing |
| Number of Positions or Pins (Grid): | 2 (1 x 2) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature: | - |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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511-91-153-15-061002Mill-Max |
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11-0518-11Aries Electronics, Inc. |
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32-6573-10Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 32POS TIN |
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32-81000-610CAries Electronics, Inc. |
CONN IC DIP SOCKET 32POS GOLD |
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04-7560-10Aries Electronics, Inc. |
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551-10-084-13-081003Mill-Max |
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614-93-121-11-000012Mill-Max |
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14-3511-11Aries Electronics, Inc. |
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In Stock: 0 $5.43400 |
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614-93-952-31-002000Mill-Max |
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In Stock: 0 $17.63107 |
