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| Type | Description |
|---|---|
| Series: | 614 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 52 (2 x 26) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Carrier, Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
|
510-13-045-08-005003Mill-Max |
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38-1518-00Aries Electronics, Inc. |
CONN IC DIP SOCKET 38POS GOLD |
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14-81000-10Aries Electronics, Inc. |
CONN IC DIP SOCKET 14POS TIN |
In Stock: 0 $3.21300 |
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511-91-155-18-121003Mill-Max |
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20-7550-10Aries Electronics, Inc. |
CONN SOCKET SIP 20POS TIN |
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24-1508-30Aries Electronics, Inc. |
CONN IC DIP SOCKET 24POS GOLD |
In Stock: 0 $8.73385 |
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612-13-308-41-001000Mill-Max |
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223-83-632-41-101000Mill-Max |
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