Type | Description |
---|---|
Series: | 510 |
Package: | Tube |
Part Status: | Active |
Type: | PGA |
Number of Positions or Pins (Grid): | 65 (10 x 10) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | - |
Contact Finish Thickness - Post: | - |
Contact Material - Post: | Brass Alloy |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Operating Temperature: | -55°C ~ 125°C |
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210-2599-50-06023M |
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02-7520-10Aries Electronics, Inc. |
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28-8750-610CAries Electronics, Inc. |
CONN IC DIP SOCKET 28POS GOLD |
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515-13-044-08-031003Mill-Max |
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36-6820-90CAries Electronics, Inc. |
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27-7530-10Aries Electronics, Inc. |
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115-41-952-41-001000Mill-Max |
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