| Type | Description |
|---|---|
| Series: | 546 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA |
| Number of Positions or Pins (Grid): | 225 (17 x 17) |
| Pitch - Mating: | 0.050" (1.27mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Press-Fit |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Bronze |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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24-4518-11Aries Electronics, Inc. |
CONN IC DIP SOCKET 24POS GOLD |
In Stock: 0 $5.11208 |
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614-41-316-31-002000Mill-Max |
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126-41-632-41-001000Mill-Max |
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146-93-306-41-012000Mill-Max |
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1109800-10Aries Electronics, Inc. |
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