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| Type | Description |
|---|---|
| Series: | PLS |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA, ZIF (ZIP) |
| Number of Positions or Pins (Grid): | - |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
| Contact Material - Post: | Beryllium Copper |
| Housing Material: | Polyphenylene Sulfide (PPS) |
| Operating Temperature: | -65°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
|
116-43-428-41-007000Mill-Max |
CONN IC SKT DBL |
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126-41-420-41-001000Mill-Max |
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18-822-90Aries Electronics, Inc. |
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10-8440-210CAries Electronics, Inc. |
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In Stock: 0 $7.88933 |
