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225-PLS18003-12

225-PLS18003-12

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Manufacturer Part
225-PLS18003-12
Manufacturer
Aries Electronics, Inc.
Description
ZIF PGA SOCKET 225 PIN 18 X 18
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
1409
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:PLS
Package:-
Part Status:Active
Type:PGA, ZIF (ZIP)
Number of Positions or Pins (Grid):225 (15 x 15)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polyphenylene Sulfide (PPS)
Operating Temperature:-

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