Type | Description |
---|---|
Series: | 523 |
Package: | Bulk |
Part Status: | Active |
Type: | PGA |
Number of Positions or Pins (Grid): | 88 (13 x 13) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Gold |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Material - Mating: | Beryllium Copper |
Mounting Type: | Through Hole |
Features: | Open Frame |
Termination: | Wire Wrap |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin-Lead |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Brass Alloy |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
Operating Temperature: | -55°C ~ 125°C |
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317-91-111-41-005000Mill-Max |
CONN SKT SNG |
In Stock: 0 $12.44340 |
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CONN IC SKT DBL |
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16-1518-10TAries Electronics, Inc. |
CONN IC DIP SOCKET 16POS GOLD |
In Stock: 0 $1.69400 |
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614-93-072-11-042012Mill-Max |
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515-93-088-12-052003Mill-Max |
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40-6511-11Aries Electronics, Inc. |
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In Stock: 0 $14.40000 |
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163-PLS15064-12Aries Electronics, Inc. |
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STANDRD SOLDRTL |
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511-13-225-18-091001Mill-Max |
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