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| Type | Description |
|---|---|
| Series: | 558 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | BGA |
| Number of Positions or Pins (Grid): | 192 (16 x 16) |
| Pitch - Mating: | 0.050" (1.27mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Brass |
| Mounting Type: | Surface Mount |
| Features: | Closed Frame |
| Termination: | Solder |
| Pitch - Post: | 0.050" (1.27mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | FR4 Epoxy Glass |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
|
32-9513-11HAries Electronics, Inc. |
CONN IC DIP SOCKET 32POS GOLD |
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48-6820-90CAries Electronics, Inc. |
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515-91-068-10-041001Mill-Max |
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36-3572-11Aries Electronics, Inc. |
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146-41-316-41-012000Mill-Max |
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614-91-310-31-002000Mill-Max |
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In Stock: 0 $15.08400 |
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24-6508-212Aries Electronics, Inc. |
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In Stock: 0 $18.66600 |
