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| Type | Description |
|---|---|
| Series: | 510 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | PGA |
| Number of Positions or Pins (Grid): | 156 (15 x 15) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | - |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass Alloy |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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24-6501-31Aries Electronics, Inc. |
CONN IC DIP SOCKET 24POS GOLD |
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614-93-324-41-001000Mill-Max |
SOCKET CARRIER LOWPRO .300 24POS |
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24-3518-00Aries Electronics, Inc. |
CONN IC DIP SOCKET 24POS GOLD |
In Stock: 0 $3.14600 |
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523-93-124-13-041002Mill-Max |
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In Stock: 0 $50.32080 |
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In Stock: 0 $84.02900 |
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A 28-LC/7-TASSMANN WSW Components |
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