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336-PLS20019-12

336-PLS20019-12

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Manufacturer Part
336-PLS20019-12
Manufacturer
Aries Electronics, Inc.
Description
CONN SOCKET PGA ZIF GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
2682
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:PLS
Package:Bulk
Part Status:Active
Type:PGA, ZIF (ZIP)
Number of Positions or Pins (Grid):-
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:30.0µin (0.76µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Beryllium Copper
Housing Material:Polyphenylene Sulfide (PPS)
Operating Temperature:-65°C ~ 125°C

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