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| Type | Description |
|---|---|
| Series: | ICA |
| Package: | Tube |
| Part Status: | Active |
| Type: | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid): | 32 (2 x 16) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 10.0µin (0.25µm) |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
| Contact Material - Post: | Brass |
| Housing Material: | Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
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10-8250-310CAries Electronics, Inc. |
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CONN IC DIP SOCKET 18POS GOLD |
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32-6554-18Aries Electronics, Inc. |
CONN IC DIP SOCKET ZIF 32POS |
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515-13-076-11-041003Mill-Max |
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116-41-648-41-003000Mill-Max |
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