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| Type | Description |
|---|---|
| Series: | ESQT |
| Package: | Bulk |
| Part Status: | Active |
| Connector Type: | Elevated Socket |
| Contact Type: | Forked |
| Style: | Board to Board or Cable |
| Number of Positions: | 55 |
| Number of Positions Loaded: | All |
| Pitch - Mating: | 0.079" (2.00mm) |
| Number of Rows: | 5 |
| Row Spacing - Mating: | 0.079" (2.00mm) |
| Mounting Type: | Through Hole |
| Termination: | Solder |
| Fastening Type: | Push-Pull |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 3.00µin (0.076µm) |
| Insulation Color: | Black |
| Insulation Height: | 0.500" (12.70mm) |
| Contact Length - Post: | 0.350" (8.89mm) |
| Operating Temperature: | -55°C ~ 125°C |
| Material Flammability Rating: | UL94 V-0 |
| Contact Finish - Post: | Tin |
| Mated Stacking Heights: | - |
| Ingress Protection: | - |
| Features: | - |
| Current Rating (Amps): | 4.5A per Contact |
| Voltage Rating: | - |
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|---|---|---|---|
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TRI SNAP 24 SKT REC PCB TIN MC |
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CONN SOCKET 16POS 0.079 GOLD PCB |
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CONN SOCKET 57POS 0.1 TIN PCB |
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SSW-139-03-F-TSamtec, Inc. |
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LOW PROFILE/SMT STRIPS |
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In Stock: 0 $0.00000 |
