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| Type | Description |
|---|---|
| Series: | - |
| Package: | Bulk |
| Part Status: | Active |
| Type: | LGA |
| Number of Positions or Pins (Grid): | 1155 (40 x 40) |
| Pitch - Mating: | 0.036" (0.91mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 15.0µin (0.38µm) |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Surface Mount |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.036" (0.91mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 15.0µin (0.38µm) |
| Contact Material - Post: | Copper Alloy |
| Housing Material: | Thermoplastic |
| Operating Temperature: | - |
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