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| Type | Description |
|---|---|
| Series: | - |
| Package: | Tray |
| Part Status: | Active |
| Type: | PGA, ZIF (ZIP) |
| Number of Positions or Pins (Grid): | 370 (19 x 19) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | 15.0µin (0.38µm) |
| Contact Material - Mating: | Copper Alloy |
| Mounting Type: | Through Hole |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Gold |
| Contact Finish Thickness - Post: | 15.0µin (0.38µm) |
| Contact Material - Post: | Copper Alloy |
| Housing Material: | Liquid Crystal Polymer (LCP) |
| Operating Temperature: | - |
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|---|---|---|---|
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In Stock: 0 $0.00000 |
