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100-018-001

100-018-001

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Manufacturer Part
100-018-001
Manufacturer
3M
Description
CONN IC DIP SOCKET 18POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
2876
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:100
Package:Bulk
Part Status:Obsolete
Type:DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid):18 (2 x 9)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:8.00µin (0.203µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame, Seal Tape
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:Flash
Contact Material - Post:Brass
Housing Material:Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature:-65°C ~ 125°C

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