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SIP050-1X20-157BLF

SIP050-1X20-157BLF

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Manufacturer Part
SIP050-1X20-157BLF
Manufacturer
Storage & Server IO (Amphenol ICC)
Description
CONN SOCKET SIP 20POS TIN
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
3075
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:SIP050-1x
Package:Bulk
Part Status:Obsolete
Type:SIP
Number of Positions or Pins (Grid):20 (1 x 20)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Tin
Contact Finish Thickness - Mating:200.0µin (5.08µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Tin
Contact Finish Thickness - Post:200.0µin (5.08µm)
Contact Material - Post:Brass
Housing Material:Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature:-

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