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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
116-43-648-61-007000

116-43-648-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-43-648-61-007000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-91-085-11-041003

510-91-085-11-041003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
510-91-085-11-041003

Datasheet

510 Bulk Active PGA 85 (11 x 11) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
115-43-648-61-003000

115-43-648-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
115-43-648-61-003000

Datasheet

115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
517-83-364-17-091111

517-83-364-17-091111

CONN SOCKET PGA 364POS GOLD

Preci-Dip

0 -
RFQ
517-83-364-17-091111

Datasheet

517 Bulk Active PGA 364 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
122-11-952-41-001000

122-11-952-41-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
122-11-952-41-001000

Datasheet

122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
614-83-168-17-101112

614-83-168-17-101112

CONN SOCKET PGA 168POS GOLD

Preci-Dip

0 -
RFQ
614-83-168-17-101112

Datasheet

614 Bulk Active PGA 168 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
40-C182-20

40-C182-20

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

0 -
RFQ
40-C182-20

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
APH-0428-G-T

APH-0428-G-T

APH-0428-G-T

Samtec Inc.

0 -
RFQ
APH-0428-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0528-G-T

APH-0528-G-T

APH-0528-G-T

Samtec Inc.

0 -
RFQ
APH-0528-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0928-G-T

APH-0928-G-T

APH-0928-G-T

Samtec Inc.

0 -
RFQ
APH-0928-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0628-G-T

APH-0628-G-T

APH-0628-G-T

Samtec Inc.

0 -
RFQ
APH-0628-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1228-G-T

APH-1228-G-T

APH-1228-G-T

Samtec Inc.

0 -
RFQ
APH-1228-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1628-G-T

APH-1628-G-T

APH-1628-G-T

Samtec Inc.

0 -
RFQ
APH-1628-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0828-G-T

APH-0828-G-T

APH-0828-G-T

Samtec Inc.

0 -
RFQ
APH-0828-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1728-G-T

APH-1728-G-T

APH-1728-G-T

Samtec Inc.

0 -
RFQ
APH-1728-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0728-G-T

APH-0728-G-T

APH-0728-G-T

Samtec Inc.

0 -
RFQ
APH-0728-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1328-G-T

APH-1328-G-T

APH-1328-G-T

Samtec Inc.

0 -
RFQ
APH-1328-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
116-43-950-61-006000

116-43-950-61-006000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-43-950-61-006000

Datasheet

116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-93-318-61-801000

110-93-318-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-93-318-61-801000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
517-83-365-17-091111

517-83-365-17-091111

CONN SOCKET PGA 365POS GOLD

Preci-Dip

0 -
RFQ
517-83-365-17-091111

Datasheet

517 Bulk Active PGA 365 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
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