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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
123-93-964-41-001000

123-93-964-41-001000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
123-93-964-41-001000

Datasheet

123 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-424-61-001000

116-43-424-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-43-424-61-001000

Datasheet

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-324-61-001000

116-93-324-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-93-324-61-001000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-650-61-007000

116-43-650-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-43-650-61-007000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
550-10-255M16-001166

550-10-255M16-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0 -
RFQ
550-10-255M16-001166

Datasheet

550 Bulk Active BGA 255 (16 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
110-93-324-61-801000

110-93-324-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-93-324-61-801000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
HLS-0316-G-38

HLS-0316-G-38

.100" SCREW MACHINE SOCKET ARRAY

Samtec Inc.

0 -
RFQ
HLS-0316-G-38

Datasheet

HLS Tube Active SIP 48 (3 x 16) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
APA-632-G-C

APA-632-G-C

ADAPTER PLUG

Samtec Inc.

0 -
RFQ
APA-632-G-C

Datasheet

APA Bulk Active - 32 (2 x 16) Gold 20.0µin (0.51µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 20.0µin (0.51µm) Phosphor Bronze
APO-632-G-C

APO-632-G-C

.100" LOW PROFILE SCREW MACHINE

Samtec Inc.

0 -
RFQ
APO-632-G-C

Datasheet

APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polybutylene Terephthalate (PBT), Glass Filled 10.0µin (0.25µm) Phosphor Bronze
116-43-432-61-003000

116-43-432-61-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-43-432-61-003000

Datasheet

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
104-13-964-41-780000

104-13-964-41-780000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
104-13-964-41-780000

Datasheet

104 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
126-93-964-41-002000

126-93-964-41-002000

CONN IC DIP SOCKET 64POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
126-93-964-41-002000

Datasheet

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-43-964-41-002000

126-43-964-41-002000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
126-43-964-41-002000

Datasheet

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-428-61-008000

116-43-428-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-43-428-61-008000

Datasheet

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-328-61-008000

116-93-328-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-93-328-61-008000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-43-648-61-001000

111-43-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
111-43-648-61-001000

Datasheet

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
111-93-648-61-001000

111-93-648-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
111-93-648-61-001000

Datasheet

111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
550-10-256M16-000166

550-10-256M16-000166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0 -
RFQ
550-10-256M16-000166

Datasheet

550 Bulk Active BGA 256 (16 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
550-10-256M20-001166

550-10-256M20-001166

BGA PIN ADAPTER 1.27MM SMD

Preci-Dip

0 -
RFQ
550-10-256M20-001166

Datasheet

550 Bulk Active BGA 256 (20 x 20) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
115-93-964-61-001000

115-93-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
115-93-964-61-001000

Datasheet

115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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