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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
514-83-192M16-001148

514-83-192M16-001148

CONN SOCKET BGA 192POS GOLD

Preci-Dip

0 -
RFQ
514-83-192M16-001148

Datasheet

514 Bulk Active BGA 192 (16 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
712-13-264-41-001000

712-13-264-41-001000

SOCKET CARRIER DUAL INLINE 64POS

Mill-Max Manufacturing Corp.

0 -
RFQ
712-13-264-41-001000

Datasheet

712 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
514-83-223-18-091117

514-83-223-18-091117

CONN SOCKET PGA 223POS GOLD

Preci-Dip

0 -
RFQ
514-83-223-18-091117

Datasheet

514 Bulk Active PGA 223 (18 x 18) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
111-43-964-61-001000

111-43-964-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
111-43-964-61-001000

Datasheet

111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
714-43-254-31-018000

714-43-254-31-018000

CONN IC DIP SOCKET 54POS GOLD

Mill-Max Manufacturing Corp.

0 -
RFQ
714-43-254-31-018000

Datasheet

714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 54 (2 x 27) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 30.0µin (0.76µm) Brass Alloy
116-43-432-61-007000

116-43-432-61-007000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-43-432-61-007000

Datasheet

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-41-964-41-003000

126-41-964-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
126-41-964-41-003000

Datasheet

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
126-91-964-41-003000

126-91-964-41-003000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
126-91-964-41-003000

Datasheet

126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
32-C212-21

32-C212-21

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

0 -
RFQ
32-C212-21

Datasheet

EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
614-83-175-16-072112

614-83-175-16-072112

CONN SOCKET PGA 175POS GOLD

Preci-Dip

0 -
RFQ
614-83-175-16-072112

Datasheet

614 Bulk Active PGA 175 (16 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
APH-1420-G-R

APH-1420-G-R

APH-1420-G-R

Samtec Inc.

0 -
RFQ
APH-1420-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0520-G-R

APH-0520-G-R

APH-0520-G-R

Samtec Inc.

0 -
RFQ
APH-0520-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1520-G-R

APH-1520-G-R

APH-1520-G-R

Samtec Inc.

0 -
RFQ
APH-1520-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1120-G-R

APH-1120-G-R

APH-1120-G-R

Samtec Inc.

0 -
RFQ
APH-1120-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0420-G-R

APH-0420-G-R

APH-0420-G-R

Samtec Inc.

0 -
RFQ
APH-0420-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1320-G-R

APH-1320-G-R

APH-1320-G-R

Samtec Inc.

0 -
RFQ
APH-1320-G-R

Datasheet

* - Active - - - - - - - - - - - - - - -
110-93-624-61-801000

110-93-624-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-93-624-61-801000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
510-13-044-08-031003

510-13-044-08-031003

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
510-13-044-08-031003

Datasheet

510 Bulk Active PGA 44 (8 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
48-3551-11

48-3551-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-3551-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
48-3552-11

48-3552-11

CONN IC DIP SOCKET ZIF 48POS GLD

Aries Electronics

0 -
RFQ
48-3552-11

Datasheet

55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 48 (2 x 24) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
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