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IC Sockets

Manufacturer Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post

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Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
APH-0622-G-T

APH-0622-G-T

APH-0622-G-T

Samtec Inc.

0 -
RFQ
APH-0622-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1722-G-T

APH-1722-G-T

APH-1722-G-T

Samtec Inc.

0 -
RFQ
APH-1722-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-0422-G-T

APH-0422-G-T

APH-0422-G-T

Samtec Inc.

0 -
RFQ
APH-0422-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
APH-1222-G-T

APH-1222-G-T

APH-1222-G-T

Samtec Inc.

0 -
RFQ
APH-1222-G-T

Datasheet

* - Active - - - - - - - - - - - - - - -
510-91-101-13-061002

510-91-101-13-061002

SKT PGA SOLDRTL

Mill-Max Manufacturing Corp.

0 -
RFQ
510-91-101-13-061002

Datasheet

510 Bulk Active PGA 101 (13 x 13) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-13-322-61-801000

110-13-322-61-801000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-13-322-61-801000

Datasheet

110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
614-83-181-15-051112

614-83-181-15-051112

CONN SOCKET PGA 181POS GOLD

Preci-Dip

0 -
RFQ
614-83-181-15-051112

Datasheet

614 Bulk Active PGA 181 (15 x 15) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
110-43-650-61-105000

110-43-650-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-43-650-61-105000

Datasheet

110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
110-43-950-61-105000

110-43-950-61-105000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
110-43-950-61-105000

Datasheet

110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-652-61-008000

116-93-652-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-93-652-61-008000

Datasheet

116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-43-432-61-008000

116-43-432-61-008000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-43-432-61-008000

Datasheet

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
514-87-255M16-001148

514-87-255M16-001148

CONN SOCKET BGA 255POS GOLD

Preci-Dip

0 -
RFQ
514-87-255M16-001148

Datasheet

514 Bulk Active BGA 255 (16 x 16) Gold Flash Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
326-93-164-41-002000

326-93-164-41-002000

SOCKET WRAP SOLDERTAIL SIP 64POS

Mill-Max Manufacturing Corp.

0 -
RFQ
326-93-164-41-002000

Datasheet

326 Tube Active SIP 64 (1 x 64) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
2-822064-5

2-822064-5

CONN SOCKET PQFP 132POS TIN-LEAD

TE Connectivity AMP Connectors

0 -
RFQ
2-822064-5

Datasheet

- Tube Obsolete QFP 132 (4 x 33) Tin-Lead 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame 0.025" (0.64mm) Solder 0.025" (0.64mm) - Tin-Lead Liquid Crystal Polymer (LCP) 200.0µin (5.08µm) Phosphor Bronze
100-PGM13061-11

100-PGM13061-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
100-PGM13061-11

Datasheet

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
100-PGM13069-11

100-PGM13069-11

CONN SOCKET PGA GOLD

Aries Electronics

0 -
RFQ
100-PGM13069-11

Datasheet

PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
116-43-428-61-001000

116-43-428-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-43-428-61-001000

Datasheet

116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
116-93-328-61-001000

116-93-328-61-001000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
116-93-328-61-001000

Datasheet

116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
117-93-448-61-005000

117-93-448-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
117-93-448-61-005000

Datasheet

117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
117-93-648-61-005000

117-93-648-61-005000

CONN IC SKT DBL

Mill-Max Manufacturing Corp.

0 -
RFQ
117-93-648-61-005000

Datasheet

117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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