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85-PGM11008-11

85-PGM11008-11

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Manufacturer Part
85-PGM11008-11
Manufacturer
Aries Electronics, Inc.
Description
CONN SOCKET PGA GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
9627
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:PGM
Package:Bulk
Part Status:Active
Type:PGA
Number of Positions or Pins (Grid):-
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:-
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:-55°C ~ 125°C

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