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| Type | Description |
|---|---|
| Series: | 114 |
| Package: | Bulk |
| Part Status: | Active |
| Type: | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid): | 24 (2 x 12) |
| Pitch - Mating: | 0.100" (2.54mm) |
| Contact Finish - Mating: | Gold |
| Contact Finish Thickness - Mating: | Flash |
| Contact Material - Mating: | Beryllium Copper |
| Mounting Type: | Surface Mount |
| Features: | Open Frame |
| Termination: | Solder |
| Pitch - Post: | 0.100" (2.54mm) |
| Contact Finish - Post: | Tin |
| Contact Finish Thickness - Post: | - |
| Contact Material - Post: | Brass |
| Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature: | -55°C ~ 125°C |
| Image | Part Number | Description | Stock / Unit Price |
|---|---|---|---|
|
06-3518-10Aries Electronics, Inc. |
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111-93-428-61-001000Mill-Max |
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20-3518-10EAries Electronics, Inc. |
CONN IC DIP SOCKET 20POS GOLD |
In Stock: 0 $6.37105 |
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25-0503-31Aries Electronics, Inc. |
CONN SOCKET SIP 25POS GOLD |
In Stock: 0 $16.04429 |
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515-13-098-13-061001Mill-Max |
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550-10-520M31-001166Preci-Dip |
BGA PIN ADAPTER 1.27MM SMD |
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