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22-4513-11H

22-4513-11H

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Manufacturer Part
22-4513-11H
Manufacturer
Aries Electronics, Inc.
Description
CONN IC DIP SOCKET 22POS GOLD
Category
Connectors, Interconnects
Family
Sockets for ICs, Transistors
Series
-
InStock
7328
Datasheets Online
-
Inquiry

Product Specifications

Type Description
Series:Lo-PRO®file, 513
Package:Bulk
Part Status:Active
Type:DIP, 0.4" (10.16mm) Row Spacing
Number of Positions or Pins (Grid):22 (2 x 11)
Pitch - Mating:0.100" (2.54mm)
Contact Finish - Mating:Gold
Contact Finish Thickness - Mating:10.0µin (0.25µm)
Contact Material - Mating:Beryllium Copper
Mounting Type:Through Hole
Features:Closed Frame
Termination:Solder
Pitch - Post:0.100" (2.54mm)
Contact Finish - Post:Gold
Contact Finish Thickness - Post:10.0µin (0.25µm)
Contact Material - Post:Brass
Housing Material:Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:-55°C ~ 105°C

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