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Infineon Technologies TDM22545DXUMA1

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TDM22545DXUMA1
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Infineon Technologies
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DC DC Converters
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TDM22545DXUMA1 is the tape-and-reel, lead-free orderable version of Infineon's TDM22545D, a dual-phase OptiMOS™ 6 power stage module that co-packages two smart power stages, two power inductors and the input decoupling capacitors on a single substrat…
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Product Details

TDM22545DXUMA1 - Infineon OptiMOS™ 6 Dual-Phase Power Stage Module, 70A per Phase, 4.25V to 16V Input, LGA-72 | TDM22545D

TDM22545DXUMA1 is the tape-and-reel, lead-free orderable version of Infineon's TDM22545D, a dual-phase OptiMOS™ 6 power stage module that co-packages two smart power stages, two power inductors and the input decoupling capacitors on a single substrate. It implements two independent synchronous-buck phases of a multiphase voltage regulator, delivering 70 A per phase continuous (thermally managed) and 160 A peak from a 4.25 V to 16 V input, with an output range of 0.225 V to 3 V and switching up to 2 MHz. Driven by a 3.3 V tri-state PWM input from an external multiphase controller, it targets the high-current core rails of AI accelerators, server CPUs, GPUs and FPGAs in a compact 10 x 9 x 5 mm LGA-72 package.

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Product Introduction

TDM22545D is not a stand-alone DC-DC converter but a dual-phase power stage module: it integrates the two most layout-sensitive parts of a multiphase buck regulator, the smart power stages and the output inductors, and leaves the control loop to an external multiphase PWM controller. Each of the two phases pairs an Infineon OptiMOS™ 6 high-side and low-side MOSFET with an optimized gate driver, then stacks a power inductor directly on top using Infineon's inductor-on-top construction. The result is two complete, independent synchronous-buck power trains that a controller can interleave to feed a single high-current rail.

Co-packaging the switches, drivers, inductors and input decoupling into one 10 x 9 x 5 mm LGA module removes roughly 40% of the board area a discrete two-phase design would occupy, and it isolates the noisy switch node from the motherboard. Because the switch node never reaches the PCB, switching noise is kept off sensitive signals and the parasitic inductance of the node is minimized, which is what lets the module run efficiently at the 600 kHz to 1.2 MHz range its inductors are tuned for, and up to 2 MHz where the application demands the smallest output filter. Each phase carries 70 A continuous under thermal management and supports 160 A peak for load transients.

The module reports what a discrete stage cannot. On-chip current sensing mirrors the MOSFET current and outputs it at 5 uA/A, far more accurate than inductor-DCR or Rds(on) sensing, while an 8 mV/°C analog pin reports die temperature. Protection is built in at the stage: cycle-by-cycle over-current protection with a fault flag, over-temperature protection with thermal shutdown, high-side short detection, VCC under-voltage lockout, and a bootstrap circuit that auto-refreshes its capacitor so a phase can idle without losing gate drive. Pulling a phase enable low drops it into a 32 uA DEEP SLEEP, and Body-Braking™ transient support sinks energy quickly when a load releases.

Expert Technical Insight

Where does TDM22545D sit in a high-current power tree, and what does it leave to the system designer?

  • A power stage, not a regulator: The output voltage, current sharing and loop compensation are set entirely by the external multiphase controller. TDM22545D contributes the switches, drivers and inductor for two phases; the designer scales total rail current simply by paralleling more phases (more modules) under one controller, which is how a single core rail reaches hundreds or thousands of amps.
  • Place it under the processor: Because the switch node is internal, the module can be mounted on the back side of the board directly beneath the GPU or ASIC. Current then flows vertically through the board to the core instead of laterally across the package, cutting power-distribution-network loss by 90% or more, the single biggest efficiency lever at multi-hundred-amp core currents.
  • Telemetry closes the thermal loop: The 5 uA/A current monitor and 8 mV/°C temperature output let the controller balance phases and throttle before any stage overheats. With 70 A per phase thermally managed, accurate per-phase current reporting is what keeps a densely packed module array inside its thermal budget rather than de-rating the whole rail.
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Key Benefits

Two Phases in 10 x 9 x 5 mm

Two smart power stages, two inductors and the input caps are co-packaged in one LGA-72 module, cutting around 40% of the board area versus a discrete two-phase design and simplifying high-volume assembly.

70 A / Phase, 160 A Peak

Each phase delivers 70 A continuous under thermal management and 160 A peak, so a handful of modules under one controller build a core rail of several hundred amps for AI and server processors.

Switch-Node Isolation, Lower PDN Loss

Keeping the switch node inside the package lets the module sit under the processor and feed current vertically through the board, reducing power-distribution-network loss by 90% or more for higher overall efficiency.

Accurate Telemetry and Protection

On-chip 5 uA/A current sense and 8 mV/°C temperature output feed the controller, while cycle-by-cycle OCP, OTP with thermal shutdown, high-side short detection and VCC UVLO protect every phase.

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Specifications

ParameterValueCondition / Note
Device TypeDual-Phase Smart Power Stage ModuleTwo integrated synchronous-buck phases
ManufacturerInfineon TechnologiesOptiMOS™ 6 power module family
Integration2x Power Stage + 2x Inductor + Input CapsInductor-on-top construction
Input Voltage (VIN)4.25 V to 16 V12 V nominal
Output Voltage Range0.225 V to 3 VAt VIN = 12 V, set by external controller
Continuous Current70 A per phaseThermally managed
Peak Current160 ATransient capability
Switching FrequencyUp to 2 MHzInductors optimized 600 kHz to 1.2 MHz
Control Interface3.3 V Tri-State PWMPer-phase PWM and EN inputs
Current Monitor5 uA/AOn-chip MOSFET current sense (IMON)
Temperature Monitor8 mV/°CAnalog output (TMON)
ProtectionOCP (cycle-by-cycle) + flag, OTP, HSS, UVLOBootstrap UVP with auto-refresh
Low-Power ModeDEEP SLEEP via EN = low32 uA typ per phase
Operating Temperature-40 °C to 125 °CIndustrial; qualified to JESD47 / IPC9701
PackageLG-MLGA-72, 10 x 9 x 5 mmLead-free, RoHS, MSL 3 @ 260 °C
Orderable Part NumberTDM22545DXUMA1X = Pb-free/RoHS, U = tape and reel

Note: Values are taken from the Infineon TDM22545D datasheet (V1.0) and the TDM22544D/TDM22545D product brief. The output voltage, current sharing and loop response are governed by the external multiphase controller; confirm every parameter against the latest official documentation before committing a design.

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Package Information

TDM22545D is supplied in an LG-MLGA-72 module measuring 10 mm x 9 mm x 5 mm, an over-moulded land-grid-array outline with 72 lands on the bottom and the two power inductors forming the visible top surface. The 5 mm profile is set by the inductor-on-top stack, which routes heat from the power stages up through the inductor to the top of the module while the LGA lands carry the high phase currents down into the board. The part is lead-free and RoHS compliant (the "X" in the orderable code), rated to moisture-sensitivity level 3 at 260 °C reflow, and screened to ESD HBM Class 2 and CDM Class C3. The orderable TDM22545DXUMA1 ships in tape and reel. Dimensions and the marking layout are shown below.

📄 Download the official Infineon TDM22545D Datasheet (PDF)

TDM22545D LG-MLGA-72 package dimensions, 10 x 9 x 5 mm
P

Pin and Signal Definition

The LGA-72 lands group into two mirrored phases plus shared bias and telemetry. The functional signals of TDM22545D are:

  • VIN: Power input, 4.25 V to 16 V, feeding both phases. Decouple locally with the lowest-inductance path; the module already integrates input decoupling capacitance.
  • VCC: Bias and gate-drive supply for the smart power stages. Decouple close to the lands.
  • VOUT1 / VOUT2: The two phase outputs, each taken from its integrated inductor. Tied together at the load to form one interleaved high-current rail.
  • PWM1 / PWM2: 3.3 V tri-state PWM control inputs, one per phase, driven by the external multiphase controller. The tri-state level commands high-side on, low-side on, or high-impedance (diode emulation).
  • EN1 / EN2: Per-phase enable. Driving an enable low places that phase in 32 uA DEEP SLEEP for light-load phase shedding.
  • IMON1 / IMON2: Analog current-monitor outputs at 5 uA/A, reporting each phase current to the controller for current balancing and protection.
  • TMON1 / TMON2: Analog temperature outputs at 8 mV/°C for per-phase thermal monitoring and throttling.
  • PGND / GND: Power-ground return for the phase currents and the signal-ground reference for the bias and telemetry pins.
TDM22545D top-side and bottom-side view showing the 72-LGA land array
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Alternative and Related Parts

The parts below are references across Infineon's dual-phase power-module family and the surrounding system. They are not drop-in replacements; verify current rating, current-sense gain, package and the matching controller before substituting.

Part NumberBrandType / Key DifferencePackageNote
TDM22544DInfineonDual-Phase Power Module / lower current, 8 uA/A current senseLG-MLGA-72Family sibling for lower per-phase current
TDM22545TInfineonDual-Phase Power Module / sense-gain variant of the 545 stageLG-MLGA-72Alternate telemetry option, same footprint class
TDA21570InfineonSingle-Phase Smart Power Stage (DrMOS) / discrete inductorPG-VSONStep down to a DrMOS + external inductor approach
XDPE192C3BInfineonMultiphase Digital Controller / drives the PWM and reads IMONQFNCompanion controller, not a replacement
MPM3695-100MPSScalable Power Module / 100 A, integrated controllerBGA / LGAClass-equivalent module from another vendor

Selection Tips: Choose TDM22545D when a core rail needs 70 A per phase with accurate 5 uA/A telemetry; step to TDM22544D where per-phase current and cost are lower; move to a DrMOS such as TDA21570 plus a discrete inductor when board height rules out a 5 mm module. In every case the module pairs with a multiphase controller such as XDPE192C3B, which sets the output voltage and balances the phases.

M

Manufacturer Information

Infineon Technologies AG, headquartered in Neubiberg near Munich, Germany, is a leading supplier of power semiconductors and power-management solutions. The TDM22xxx OptiMOS™ dual-phase power modules sit within Infineon's power-conversion portfolio for computing and data-center power, building on the OptiMOS™ 6 MOSFET technology and the smart-power-stage (DrMOS) lines.

The dual-phase module family is positioned for "sustainable AI" power delivery: by raising efficiency at the processor core and reducing power-distribution-network loss, large GPU and accelerator deployments save meaningful energy at fleet scale. Infineon offers the matching multiphase digital controllers and single-phase smart power stages, giving a coherent migration path from discrete DrMOS designs to fully integrated module-based core rails.

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Applications

AI Accelerators and Data Center
AI Accelerators & Data Center
GPU and AI-Accelerator Core Power, TPU/ASIC Rails, HBM Memory Supplies
Typical Case: An AI accelerator card needs a sub-1 V core rail at well over a thousand amps. A row of TDM22545D modules is mounted on the back of the board directly beneath the ASIC, each contributing two 70 A phases that one multiphase controller interleaves. Current flows vertically up into the die, the per-phase IMON signals keep the phases balanced, and the 90% lower PDN loss is what makes a 2000 A core rail thermally feasible inside the card.
Communications and Networking
Communications & Networking
Switch and Router Line Cards, Optical Transport, FPGA Packet Processing
Typical Case: A high-radix switch ASIC and its FPGA companions sit on a dense line card with little spare area. Two TDM22545D modules build the 0.8 V and 0.9 V core and SerDes rails, the 2 MHz-capable inductors keep the output filter small, and switch-node isolation stops the regulator from coupling noise into the high-speed lanes routed nearby.
Server CPU and Multiphase VR
Server CPU & Multiphase VR
Server and Workstation CPU VRMs, Vcore and DDR5 Rails, Open-Compute Boards
Typical Case: A server CPU VRM is built from several TDM22545D modules around the socket, each phase reporting current at 5 uA/A so the controller trims phase count to load. At idle, phases are shed into DEEP SLEEP to hold light-load efficiency; under a turbo step, the 160 A peak per module and Body-Braking™ transient support keep Vcore inside its window.
Robotics and Edge AI
Robotics & Edge AI
Autonomous Compute Modules, Edge-AI Inference Boards, Vision SoC Power
Typical Case: An autonomous-robot compute module runs a high-TOPS inference SoC whose core rail swings hard between perception bursts and idle. A pair of TDM22545D modules supplies the rail in a tight enclosure; the integrated inductors save board area for sensors, while per-phase temperature monitoring lets the controller throttle before the sealed chassis overheats.
Q

Frequently Asked Questions

Is TDM22545D a complete DC-DC converter?

No. TDM22545D is a dual-phase power stage module, not a self-contained regulator. It integrates two smart power stages and two inductors but relies on an external multiphase PWM controller to set the output voltage, balance the phases and close the loop. The controller drives the PWM inputs and reads the IMON and TMON telemetry.

How much current can TDM22545D deliver?

Each of its two phases delivers 70 A continuous under thermal management, with 160 A peak capability for transients. Because it is a power stage, total rail current scales by paralleling more modules under one controller, which is how AI and server core rails reach several hundred to a few thousand amps.

What is the difference between TDM22545D, TDM22544D and TDM22545T?

They share the LG-MLGA-72 dual-phase module construction. TDM22545D provides 70 A per phase with a 5 uA/A current monitor; TDM22544D is the lower-current sibling with an 8 uA/A monitor; TDM22545T is a sense-gain variant of the 545 power stage. Choose by per-phase current and the telemetry gain your controller expects.

Why mount the module under the processor?

Because the switch node is internal to the module, it can sit on the back of the board directly beneath the GPU or ASIC. Current then flows vertically through the board to the core instead of laterally across the package, which cuts power-distribution-network loss by 90% or more and is the key to feeding a multi-hundred-amp core rail efficiently.

D

Disclaimer

Information Accuracy: The specifications on this page are based on the official Infineon TDM22545D datasheet and the TDM22544D/TDM22545D product brief. We work to keep the information accurate and complete, but parameters can change with product revisions, so design engineers should verify all values against the latest official documentation before final design.

Product Authenticity Guarantee: All parts we supply are genuine factory originals with full material traceability.

Technical Support: Pre-sales and post-sales technical consultation is available free of charge.

Application Notice: This page is for reference only. Suitability for a specific application should be confirmed by the design engineer against the actual system requirements.

TDM22545DXUMA1 TDM22545D Infineon OptiMOS 6 dual-phase power stage module integrated inductor smart power stage DrMOS LG-MLGA-72 72-LGA 70A per phase 160A peak multiphase buck voltage regulator VRM AI accelerator GPU CPU FPGA core power data center point of load IMON TMON PWM 4.25V 16V 0.225V 3V 2MHz

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