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NXP Semiconductors LPC812M101JDH20FP

Part No.:
LPC812M101JDH20FP
Manufacturer:
NXP Semiconductors
Category:
Microcontrollers
Package:
20-TSSOP (0.173", 4.40mm Width)
Datasheet:
LPC812M101JDH20FP.pdf
Description:
IC MCU 32BIT 16KB FLASH 20TSSOP
Quantity:

Unit Price:$1.444400

Ext Price:$1.444400

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Product Details

LPC812M101JDH20FP - NXP ARM Cortex-M0+ 32-bit MCU (48MHz / 32KB Flash / TSSOP-20)

LPC812M101JDH20FP is an NXP LPC800 series ARM Cortex-M0+ microcontroller, operating at 48MHz with 32KB Flash and 4KB SRAM, operating voltage 1.8V~3.6V, housed in a compact TSSOP-20 package, featuring SWD debug interface, multiple UART channels, and 16-bit timers, with built-in 12MHz internal RC oscillator (±1% accuracy), widely used in IoT sensor nodes, consumer electronics and industrial control applications.

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Product Overview

LPC812M101JDH20FP is NXP's entry-level Cortex-M0+ microcontroller in the LPC800 series, featuring a small package, multi-UART interfaces and low-power design. Compared to the LPC811, the LPC812 increases Flash to 32KB and adds more communication interface options.

This chip uses the ARM Cortex-M0+ core, with the standout feature of integrating rich communication peripherals within the extremely compact TSSOP-20 package: 2 UART channels, 1 SPI and 1 I2C, capable of connecting multiple sensors or communication modules simultaneously. The built-in 12MHz internal RC oscillator (accuracy ±1%) meets UART communication accuracy requirements without external crystals, significantly reducing BOM cost and PCB area.

LPC812 supports Deep Power-down mode with current as low as approximately 1μA, and can be awakened externally via the WKUP pin, making it ideal for battery-powered IoT sensor nodes. The SWD debug interface supports full program download and in-circuit debugging with MCUXpresso IDE or LPCXpresso toolchain for an excellent development experience.

Expert Technical Insight

Why is the LPC812 widely favored in the IoT sensor node market?

  • Optimal balance of small package and rich interfaces: TSSOP-20 (7.6mm x 4.4mm) is one of the highest pin-count packages available for 8-20 pin MCUs. The LPC812 fully utilizes these 20 pins, providing 2 UART, 1 SPI, 1 I2C, 4x 16-bit timers, and up to 18 GPIOs. Compared to competitors offering only 1 UART or 1 SPI in 20 pins, the LPC812 has a clear advantage in interface density
  • Internal RC oscillator eliminates crystal BOM cost: Built-in 12MHz IRC accuracy ±1% (across full temperature range ±2%), meeting UART communication ±2.5% error margin requirements without external 8MHz crystal. Each IoT sensor node saves approximately $0.10-$0.30 in BOM cost and one SMT pad. For mass production of 100,000 units, this means saving $10,000-$30,000
  • Flexible Switch Matrix enables pin multiplexing: The LPC812's configurable pin connection matrix allows each peripheral to be mapped to any pin, completely solving the layout difficulties caused by traditional MCU fixed pins. Engineers can place UART_TX on the most convenient pin on the PCB, significantly optimizing PCB routing and shortening development cycles
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Key Benefits

Cortex-M0+ Core @ 48MHz

ARM architecture, Thumb-2 instruction set, 1.25 DMIPS/MHz, CMSIS-compliant, mature ecosystem.

32KB Flash + 4KB SRAM

32KB programmable Flash with IAP in-system programming support; 4KB SRAM for sensor data buffering.

Rich Communication Peripherals

2x UART, 1x SPI, 1x I2C with flexible pin switch matrix configuration for multi-sensor connectivity.

Internal IRC Oscillator ±1%

Built-in 12MHz RC oscillator, ±1% accuracy at 25°C, eliminates external crystal and reduces BOM cost.

S

Specifications

Parameter Value Condition / Notes
Device Type 32-bit ARM Cortex-M0+ MCU LPC800 Series
Manufacturer NXP Semiconductors NXP
CPU Clock 48MHz (max) ARM Cortex-M0+
Flash Memory 32KB IAP in-system programming supported
SRAM 4KB System RAM and data cache
Operating Voltage 1.8V ~ 3.6V Typical 3.3V
GPIO Pins Up to 18 Configurable via switch matrix
UART 2 channels With DMA support
SPI 1 channel Up to 12MHz
I2C 1 channel Fast Mode 400kHz supported
Timers 4x 16-bit general-purpose timers PWM output supported
Internal RC Oscillator 12MHz ±1% At 25°C; ±2% full temperature
Package TSSOP-20 0.65mm pin pitch
Mounting Surface Mount (SMT) Reflow soldering compatible
Operating Temperature -40°C ~ +105°C Industrial grade

Note: For detailed electrical parameters, power consumption data and peripheral configuration, please refer to the official NXP datasheet. Parameters are subject to change without notice. Design engineers should verify all parameters before finalizing designs.

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Package Information

LPC812M101JDH20FP uses the standard TSSOP-20 (Thin Shrink Small Outline Package) with 0.65mm pin pitch, 20 gull-wing leads, package height approximately 1.0mm, suitable for compact PCB designs.

The TSSOP-20 package measures approximately 6.5mm x 4.4mm. Compared to DIP-20 (which requires through-hole plating), TSSOP saves approximately 60% of PCB area. Compared to QFN-20 (which requires bottom pad solder reflow process control), TSSOP offers better manufacturability and visual inspection accessibility. Pin assignments follow standard I/O arrangement with GPIO and power pins distributed on both sides.

LPC812M101JDH20FP_pkg.png
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Pinout (TSSOP-20)

The LPC812M101JDH20FP in TSSOP-20 package has 20 pins. Key pin definitions are as follows:

  • Pin 1 - PIO0_0 / WKUP / CLKO: General-purpose GPIO, configurable as wake-up pin or clock output (CLKOUT), supports wake from Deep Power-down mode.
  • Pin 2 - PIO0_1 / UART0_TXD: General-purpose GPIO, UART0 transmit data pin, can be mapped to any pin via switch matrix.
  • Pin 3 - PIO0_2 / UART0_RXD: General-purpose GPIO, UART0 receive data pin, supports UART wake functionality.
  • Pin 4 - PIO0_3 / SDA / UART1_TXD: General-purpose GPIO, configurable as I2C data pin (SDA) or UART1 transmit pin.
  • Pin 5 - PIO0_4 / SCL / UART1_RXD: General-purpose GPIO, configurable as I2C clock pin (SCL) or UART1 receive pin.
  • Pin 6 - VSS (Ground): Chip ground pin, should be connected to PCB ground plane via short wide trace.
  • Pin 7 - VDD (Power): Chip power pin, typically 3.3V, recommended to place 100nF decoupling capacitor nearby.
  • Pin 8 - PIO0_5 / SPI_SCK / U0_SCLK: General-purpose GPIO, SPI clock pin or UART0 clock input.
  • Pin 9 - PIO0_6 / SPI_MISO / SPI_MOSI: General-purpose GPIO, SPI MISO/MOSI, supports full-duplex communication.
  • Pin 10 - PIO0_7 / SPI_SSEL: General-purpose GPIO, SPI slave select pin, active low.
  • Pin 11 - PIO0_8 / CT16B0_CAP0: General-purpose GPIO, 16-bit timer 0 capture pin.
  • Pin 12 - PIO0_9 / CT16B0_MAT0: General-purpose GPIO, 16-bit timer 0 match output pin, can output PWM signals.
  • Pin 13 - PIO0_10 / CT16B0_MAT1: General-purpose GPIO, 16-bit timer 0 match output 1.
  • Pin 14 - PIO0_11 / SWDIO: Debug interface data line, SWD protocol bidirectional data pin, also usable as GPIO.
  • Pin 15 - PIO0_12 / SWCLK: Debug interface clock line, SWD protocol clock pin, also usable as GPIO.
  • Pin 16 - PIO0_13 / UART2_TXD / UART1_RTS: General-purpose GPIO, UART2 transmit or UART1 request to send.
  • Pin 17 - PIO0_14 / UART2_RXD / UART1_CTS: General-purpose GPIO, UART2 receive or UART1 clear to send.
  • Pin 18 - PIO0_15 / UART2_SCLK: General-purpose GPIO, UART2 clock pin.
  • Pin 19 - PIO0_16 / CT32B0_CAP0: General-purpose GPIO, 32-bit timer 0 capture pin.
  • Pin 20 - PIO0_17 / RESET: External reset pin, active low, has internal pull-up resistor.
LPC812M101JDH20FP_pin.png
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Alternative Parts

The following alternative parts are listed for reference. Before selecting an alternative, verify communication interface, supply voltage, security algorithm compatibility, and software API differences.

Part Number Brand Type Package Key Feature
LPC812M101JD20FP NXP Cortex-M0+ / 48MHz / 32KB Flash SOIC-20 Same series, SOIC-20 package version, pin-compatible
STM32F030F4P6 STMicroelectronics Cortex-M0 / 48MHz / 16KB Flash TSSOP-20 Same package, 16KB Flash, functionally compatible
LPC1114FN28/102 NXP Cortex-M0 / 50MHz / 32KB Flash DIP-28 NXP same family Cortex-M0, DIP-28 larger package, good for prototyping
ATtiny817-MFR Microchip tinyAVR / 16MHz / 8KB Flash SOIC-14 Different architecture (AVR), low power, simplified peripherals
LPC54114J256BD64QL NXP Cortex-M0+/M4 / 100MHz / 256KB Flash LQFP-64 Dual-core high performance, larger package, functional reference

Selection Tips: When selecting alternatives, pay attention to: core architecture differences (Cortex-M0+ vs M0 vs AVR) affecting toolchain and driver code; Flash/SRAM capacity vs application requirements; package and pin layout compatibility with existing PCB; operating voltage range; and peripheral interface quantity and type matching.

M

Manufacturer Information

NXP Semiconductors (NASDAQ: NXPI), headquartered in Eindhoven, Netherlands, is a leading global semiconductor company, formerly the semiconductor division of Philips. NXP's products cover automotive electronics, mobile communications, industrial IoT, consumer electronics and computing infrastructure. The LPC series ARM Cortex-M microcontrollers have gained significant market share in the global embedded market with their rich product portfolio, mature ecosystem tools and reliable quality.

The LPC800 series is NXP's entry-level Cortex-M0+ product line for IoT nodes and cost-sensitive applications, featuring small packages, rich interfaces and low BOM cost. As the high-end model in this series, the LPC812 integrates 2 UART, 1 SPI and 1 I2C in the compact TSSOP-20 package with flexible pin switch matrix configuration. NXP provides free MCUXpresso IDE and configuration tools, along with detailed reference manuals and application notes, significantly shortening product development cycles. The LPC series has comprehensive technical support and distribution channels in China.

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Application Areas

Industrial Automation
Industrial Automation
Industrial sensor nodes, PLC expansion modules, machine condition monitoring, relay control
Typical Case: In factory equipment condition monitoring systems, the LPC812M101JDH20FP serves as the edge sensor node core, connecting to vibration sensors (accelerometer) via UART, temperature/humidity sensors via I2C, and uploading data to gateway via LoRa wireless module through SPI. TSSOP-20 compact package suits small sensor PCBs. Built-in IRC eliminates external crystals saving cost. Deep power-down mode below 1μA enables dry battery operation for over 2 years.
Communications and Networking
Communications and Networking
IoT gateway, slave communication nodes, serial servers, Modbus-RTU master/slave
Typical Case: In building automation Modbus-RTU networks, the LPC812 acts as the slave controller, connecting to RS-485 transceiver via UART0 for half-duplex communication at 115200bps. IRC accuracy of ±1% meets Modbus RTU timing requirements. UART1 connects to Wi-Fi module for cloud upload, SPI connects to local display driver IC. Switch matrix routes two UARTs to optimal PCB locations, significantly simplifying PCB layout.
Consumer Electronics
Consumer Electronics
Smart home appliance control, electric toothbrush, electric shaver, e-cigarette controller, handheld devices
Typical Case: In smart electric toothbrushes, the LPC812 serves as the main controller, driving brushless motors via PWM output (timer MAT output), connecting to Bluetooth BLE module via UART to communicate with smartphone App, reporting brushing mode and battery level in real time. TSSOP-20 package fits compact electric toothbrush handle PCB. 1.8V-3.6V wide voltage range compatible with lithium battery supply (3.7V-4.2V). Deep power-down mode with WKUP pin wake via hall switch enables power on/off control.
Industrial IoT
Industrial IoT (IIoT)
IIoT sensor terminals, asset tracking tags, smart agriculture nodes, smart lighting control
Typical Case: In smart agriculture soil monitoring stations, the LPC812 connects to soil moisture and pH sensors via I2C, uploading data periodically via NB-IoT module connected to UART. Timer generates precise wake intervals (sampling every hour), with the rest of the time in deep power-down (current <1μA). Lithium battery can power the system for 3-5 years. IRC eliminates external crystals, saving BOM cost and PCB area. The entire module can be made matchbox-sized, suitable for large-scale outdoor deployment.
Q

Frequently Asked Questions

What is LPC812M101JDH20FP used for?

LPC812M101JDH20FP is used in electronic designs according to the function and limits described in the manufacturer datasheet.

Can LPC812M101JDH20FP be replaced by another part?

Only after verifying package, pinout, electrical limits and software or circuit compatibility.

Where should the final parameters be checked?

Use the official manufacturer datasheet and latest ordering documentation before final design release.

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Disclaimer

Information Accuracy: Technical specifications listed on this page are based on official NXP datasheets. We strive to ensure accuracy and completeness. Due to product improvements, specifications are subject to change without notice. Design engineers should verify all parameters before finalizing their designs.

Product Authenticity: We guarantee all products sold are genuine factory originals with complete material traceability.

Technical Support: Free technical consultation services are available before and after purchase.

Application Notice: This product page is for reference only. Suitability for specific applications should be verified by design engineers based on actual system requirements.

LPC812M101JDH20FP NXP ARM Cortex-M0+ MCU 32-bit 48MHz 32KB Flash TSSOP-20 IoT Consumer Electronics Industrial Sensing

LPC812M101JDH20FP Specifications

  • Specifications
Attributes
Property Value
Manufacturer
NXP Semiconductors
Package/Case:
20-TSSOP (0.173", 4.40mm Width)
Series:
LPC81xM
Packaging:
Tube
Part Status:
Active
Programmable:
Not Verified
Core Processor:
ARM® Cortex®-M0+
Speed:
30MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Grade:
-
Number of I/O:
18
Program Memory Size:
16KB (16K x 8)
Core Size:
32-Bit Single-Core
Program Memory Type:
FLASH
EEPROM Size:
-
Operating Temperature:
-40°C ~ 105°C (TA)
RAM Size:
4K x 8
Qualification:
-
Oscillator Type:
Internal
Voltage - Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
-
Mounting Style:
Surface Mount
Supplier Device Package:
Category:
Microcontrollers
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