NXP Semiconductors LPC812M101JDH20FP
- Part No.:
- LPC812M101JDH20FP
- Manufacturer:
- NXP Semiconductors
- Category:
- Microcontrollers
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
LPC812M101JDH20FP.pdf
- Description:
- IC MCU 32BIT 16KB FLASH 20TSSOP
- Quantity:
Unit Price:$1.444400
Ext Price:$1.444400
- Payment:

- Shipping:

Inventory:9,000
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In Stock : 9,000 PCS
| Qty. | Unit Price | Ext Price |
| 1+ | $1.444400 | $1.444400 |
| 1000+ | $1.231700 | $1231.700000 |
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Product Details
LPC812M101JDH20FP - NXP ARM Cortex-M0+ 32-bit MCU (48MHz / 32KB Flash / TSSOP-20)
LPC812M101JDH20FP is an NXP LPC800 series ARM Cortex-M0+ microcontroller, operating at 48MHz with 32KB Flash and 4KB SRAM, operating voltage 1.8V~3.6V, housed in a compact TSSOP-20 package, featuring SWD debug interface, multiple UART channels, and 16-bit timers, with built-in 12MHz internal RC oscillator (±1% accuracy), widely used in IoT sensor nodes, consumer electronics and industrial control applications.
Product Overview
LPC812M101JDH20FP is NXP's entry-level Cortex-M0+ microcontroller in the LPC800 series, featuring a small package, multi-UART interfaces and low-power design. Compared to the LPC811, the LPC812 increases Flash to 32KB and adds more communication interface options.
This chip uses the ARM Cortex-M0+ core, with the standout feature of integrating rich communication peripherals within the extremely compact TSSOP-20 package: 2 UART channels, 1 SPI and 1 I2C, capable of connecting multiple sensors or communication modules simultaneously. The built-in 12MHz internal RC oscillator (accuracy ±1%) meets UART communication accuracy requirements without external crystals, significantly reducing BOM cost and PCB area.
LPC812 supports Deep Power-down mode with current as low as approximately 1μA, and can be awakened externally via the WKUP pin, making it ideal for battery-powered IoT sensor nodes. The SWD debug interface supports full program download and in-circuit debugging with MCUXpresso IDE or LPCXpresso toolchain for an excellent development experience.
Expert Technical Insight
Why is the LPC812 widely favored in the IoT sensor node market?
- Optimal balance of small package and rich interfaces: TSSOP-20 (7.6mm x 4.4mm) is one of the highest pin-count packages available for 8-20 pin MCUs. The LPC812 fully utilizes these 20 pins, providing 2 UART, 1 SPI, 1 I2C, 4x 16-bit timers, and up to 18 GPIOs. Compared to competitors offering only 1 UART or 1 SPI in 20 pins, the LPC812 has a clear advantage in interface density
- Internal RC oscillator eliminates crystal BOM cost: Built-in 12MHz IRC accuracy ±1% (across full temperature range ±2%), meeting UART communication ±2.5% error margin requirements without external 8MHz crystal. Each IoT sensor node saves approximately $0.10-$0.30 in BOM cost and one SMT pad. For mass production of 100,000 units, this means saving $10,000-$30,000
- Flexible Switch Matrix enables pin multiplexing: The LPC812's configurable pin connection matrix allows each peripheral to be mapped to any pin, completely solving the layout difficulties caused by traditional MCU fixed pins. Engineers can place UART_TX on the most convenient pin on the PCB, significantly optimizing PCB routing and shortening development cycles
Key Benefits
ARM architecture, Thumb-2 instruction set, 1.25 DMIPS/MHz, CMSIS-compliant, mature ecosystem.
32KB programmable Flash with IAP in-system programming support; 4KB SRAM for sensor data buffering.
2x UART, 1x SPI, 1x I2C with flexible pin switch matrix configuration for multi-sensor connectivity.
Built-in 12MHz RC oscillator, ±1% accuracy at 25°C, eliminates external crystal and reduces BOM cost.
Specifications
| Parameter | Value | Condition / Notes |
|---|---|---|
| Device Type | 32-bit ARM Cortex-M0+ MCU | LPC800 Series |
| Manufacturer | NXP Semiconductors | NXP |
| CPU Clock | 48MHz (max) | ARM Cortex-M0+ |
| Flash Memory | 32KB | IAP in-system programming supported |
| SRAM | 4KB | System RAM and data cache |
| Operating Voltage | 1.8V ~ 3.6V | Typical 3.3V |
| GPIO Pins | Up to 18 | Configurable via switch matrix |
| UART | 2 channels | With DMA support |
| SPI | 1 channel | Up to 12MHz |
| I2C | 1 channel | Fast Mode 400kHz supported |
| Timers | 4x 16-bit general-purpose timers | PWM output supported |
| Internal RC Oscillator | 12MHz ±1% | At 25°C; ±2% full temperature |
| Package | TSSOP-20 | 0.65mm pin pitch |
| Mounting | Surface Mount (SMT) | Reflow soldering compatible |
| Operating Temperature | -40°C ~ +105°C | Industrial grade |
Note: For detailed electrical parameters, power consumption data and peripheral configuration, please refer to the official NXP datasheet. Parameters are subject to change without notice. Design engineers should verify all parameters before finalizing designs.
Package Information
LPC812M101JDH20FP uses the standard TSSOP-20 (Thin Shrink Small Outline Package) with 0.65mm pin pitch, 20 gull-wing leads, package height approximately 1.0mm, suitable for compact PCB designs.
The TSSOP-20 package measures approximately 6.5mm x 4.4mm. Compared to DIP-20 (which requires through-hole plating), TSSOP saves approximately 60% of PCB area. Compared to QFN-20 (which requires bottom pad solder reflow process control), TSSOP offers better manufacturability and visual inspection accessibility. Pin assignments follow standard I/O arrangement with GPIO and power pins distributed on both sides.
Pinout (TSSOP-20)
The LPC812M101JDH20FP in TSSOP-20 package has 20 pins. Key pin definitions are as follows:
- Pin 1 - PIO0_0 / WKUP / CLKO: General-purpose GPIO, configurable as wake-up pin or clock output (CLKOUT), supports wake from Deep Power-down mode.
- Pin 2 - PIO0_1 / UART0_TXD: General-purpose GPIO, UART0 transmit data pin, can be mapped to any pin via switch matrix.
- Pin 3 - PIO0_2 / UART0_RXD: General-purpose GPIO, UART0 receive data pin, supports UART wake functionality.
- Pin 4 - PIO0_3 / SDA / UART1_TXD: General-purpose GPIO, configurable as I2C data pin (SDA) or UART1 transmit pin.
- Pin 5 - PIO0_4 / SCL / UART1_RXD: General-purpose GPIO, configurable as I2C clock pin (SCL) or UART1 receive pin.
- Pin 6 - VSS (Ground): Chip ground pin, should be connected to PCB ground plane via short wide trace.
- Pin 7 - VDD (Power): Chip power pin, typically 3.3V, recommended to place 100nF decoupling capacitor nearby.
- Pin 8 - PIO0_5 / SPI_SCK / U0_SCLK: General-purpose GPIO, SPI clock pin or UART0 clock input.
- Pin 9 - PIO0_6 / SPI_MISO / SPI_MOSI: General-purpose GPIO, SPI MISO/MOSI, supports full-duplex communication.
- Pin 10 - PIO0_7 / SPI_SSEL: General-purpose GPIO, SPI slave select pin, active low.
- Pin 11 - PIO0_8 / CT16B0_CAP0: General-purpose GPIO, 16-bit timer 0 capture pin.
- Pin 12 - PIO0_9 / CT16B0_MAT0: General-purpose GPIO, 16-bit timer 0 match output pin, can output PWM signals.
- Pin 13 - PIO0_10 / CT16B0_MAT1: General-purpose GPIO, 16-bit timer 0 match output 1.
- Pin 14 - PIO0_11 / SWDIO: Debug interface data line, SWD protocol bidirectional data pin, also usable as GPIO.
- Pin 15 - PIO0_12 / SWCLK: Debug interface clock line, SWD protocol clock pin, also usable as GPIO.
- Pin 16 - PIO0_13 / UART2_TXD / UART1_RTS: General-purpose GPIO, UART2 transmit or UART1 request to send.
- Pin 17 - PIO0_14 / UART2_RXD / UART1_CTS: General-purpose GPIO, UART2 receive or UART1 clear to send.
- Pin 18 - PIO0_15 / UART2_SCLK: General-purpose GPIO, UART2 clock pin.
- Pin 19 - PIO0_16 / CT32B0_CAP0: General-purpose GPIO, 32-bit timer 0 capture pin.
- Pin 20 - PIO0_17 / RESET: External reset pin, active low, has internal pull-up resistor.
Alternative Parts
The following alternative parts are listed for reference. Before selecting an alternative, verify communication interface, supply voltage, security algorithm compatibility, and software API differences.
| Part Number | Brand | Type | Package | Key Feature |
|---|---|---|---|---|
| LPC812M101JD20FP | NXP | Cortex-M0+ / 48MHz / 32KB Flash | SOIC-20 | Same series, SOIC-20 package version, pin-compatible |
| STM32F030F4P6 | STMicroelectronics | Cortex-M0 / 48MHz / 16KB Flash | TSSOP-20 | Same package, 16KB Flash, functionally compatible |
| LPC1114FN28/102 | NXP | Cortex-M0 / 50MHz / 32KB Flash | DIP-28 | NXP same family Cortex-M0, DIP-28 larger package, good for prototyping |
| ATtiny817-MFR | Microchip | tinyAVR / 16MHz / 8KB Flash | SOIC-14 | Different architecture (AVR), low power, simplified peripherals |
| LPC54114J256BD64QL | NXP | Cortex-M0+/M4 / 100MHz / 256KB Flash | LQFP-64 | Dual-core high performance, larger package, functional reference |
Selection Tips: When selecting alternatives, pay attention to: core architecture differences (Cortex-M0+ vs M0 vs AVR) affecting toolchain and driver code; Flash/SRAM capacity vs application requirements; package and pin layout compatibility with existing PCB; operating voltage range; and peripheral interface quantity and type matching.
Manufacturer Information
NXP Semiconductors (NASDAQ: NXPI), headquartered in Eindhoven, Netherlands, is a leading global semiconductor company, formerly the semiconductor division of Philips. NXP's products cover automotive electronics, mobile communications, industrial IoT, consumer electronics and computing infrastructure. The LPC series ARM Cortex-M microcontrollers have gained significant market share in the global embedded market with their rich product portfolio, mature ecosystem tools and reliable quality.
The LPC800 series is NXP's entry-level Cortex-M0+ product line for IoT nodes and cost-sensitive applications, featuring small packages, rich interfaces and low BOM cost. As the high-end model in this series, the LPC812 integrates 2 UART, 1 SPI and 1 I2C in the compact TSSOP-20 package with flexible pin switch matrix configuration. NXP provides free MCUXpresso IDE and configuration tools, along with detailed reference manuals and application notes, significantly shortening product development cycles. The LPC series has comprehensive technical support and distribution channels in China.
Application Areas
Frequently Asked Questions
What is LPC812M101JDH20FP used for?
LPC812M101JDH20FP is used in electronic designs according to the function and limits described in the manufacturer datasheet.
Can LPC812M101JDH20FP be replaced by another part?
Only after verifying package, pinout, electrical limits and software or circuit compatibility.
Where should the final parameters be checked?
Use the official manufacturer datasheet and latest ordering documentation before final design release.
Disclaimer
Information Accuracy: Technical specifications listed on this page are based on official NXP datasheets. We strive to ensure accuracy and completeness. Due to product improvements, specifications are subject to change without notice. Design engineers should verify all parameters before finalizing their designs.
Product Authenticity: We guarantee all products sold are genuine factory originals with complete material traceability.
Technical Support: Free technical consultation services are available before and after purchase.
Application Notice: This product page is for reference only. Suitability for specific applications should be verified by design engineers based on actual system requirements.
LPC812M101JDH20FP Specifications
- Specifications
- Attributes
- Property Value
- Manufacturer
- NXP Semiconductors
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Series:
- LPC81xM
- Packaging:
- Tube
- Part Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M0+
- Speed:
- 30MHz
- Connectivity:
- I2C, SPI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Grade:
- -
- Number of I/O:
- 18
- Program Memory Size:
- 16KB (16K x 8)
- Core Size:
- 32-Bit Single-Core
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- Operating Temperature:
- -40°C ~ 105°C (TA)
- RAM Size:
- 4K x 8
- Qualification:
- -
- Oscillator Type:
- Internal
- Voltage - Supply (Vcc/Vdd):
- 1.8V ~ 3.6V
- Data Converters:
- -
- Mounting Style:
- Surface Mount
- Supplier Device Package:
- Category:
- Microcontrollers
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